III.Kopo ea Sehlahisoa
E sebetsa bakeng sa ho lekanya botenya bo nepahetseng ba lifilimi tsa polasetiki, maqephe, diaphragm, pampiri, khateboto, lifoile, Silicon Wafer, lakane ea tšepe le lisebelisoa tse ling.
IV.Tekanyetso ea tekheniki
GB/T6672
ISO4593
V.SehlahisoaParamitha
| Lintho | Paramethara |
| Teko ea Teko | 0 ~ 10mm |
| Qeto ea teko | 0.001mm |
| Khatello ea teko | 0.5~1.0N (ha bophara ba hlooho e kaholimo ea teko e le ¢6mm 'me hlooho e ka tlase ea teko e bataletse) 0.1~ |
| Bophara ba leoto le ka hodimo | 6±0.05mm |
| Ho bapanya ha leoto ka mahlakoreng | <0.005mm |